The Chemical Bond I

Viac o knihe

The series Structure and Bonding publishes critical reviews on research topics related to chemical structure and bonding, encompassing the entire Periodic Table. It addresses structural and bonding issues for all elements and emphasizes emerging areas in modern structural and theoretical chemistry, including nanostructures, molecular electronics, designed molecular solids, surfaces, metal clusters, and supramolecular structures. The series covers physical and spectroscopic techniques for examining and modeling structures, focusing on scientific results rather than technical details. It also explores the development of bonding models and generalizations that clarify reactivity pathways and chemical process rates. Each volume is thematic, aiming to provide readers in academia and industry with a comprehensive overview of emerging insights of broader scientific interest. Reviews critically survey specific aspects of the topic and situate them within the overall context of the volume. Significant developments from the last 5 to 10 years are highlighted through selected examples. While not exhaustive in data, the coverage emphasizes conceptual understanding of new principles, making it accessible to non-specialists. Discussions on potential future research directions are encouraged, and volume editors invite review articles for inclusion.